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Intel scraps HSDPA module plans with Nokia

22 марта 2007
Intel scrapped plans to include an HSDPA module from Nokia in its next-generation Centrino Duo platform, which is set to be released in the second quarter. Intel said notebook computer vendors wouldn't be willing to pay enough to justify its investment in HSDPA. Intel announced in September plans to add an HSDPA module from Nokia that would complement its WiFi component. Intel said it isn't scrapping HSDPA for good, but won't commit to a timeline. The news puts a damper on the apparent momentum HSDPA had at the 3GSM World Congress, but looks to be great news for 3G card vendors like Sierra Wireless and Novatel Wireless, which both saw their shares drop after Intel announced its deal with Nokia. Given its vested interest in WiMAX, it wouldn't be surprising to see Intel really push 802.11n throughout 2007 until it can release as WiFi/WiMAX platform in 2008.



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